Aerosol Jet® applications at Robert Bosch GmbH · * Bundesministerium für Bildung und Forschung =...

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Robert Bosch GmbH 2011. Alle Rechte vorbehalten, auch bzgl. jeder Verfügung, Verwertung, Reproduktion, Bearbeitung, Weitergabe sowie für den Fall von Schutzrechtsanmeldungen.

Ruben WahlRobert Bosch GmbH

Corporate Research an DevelopmentDepartment of Plastic Engeneering

Waiblingen, Germany

Aerosol Jet @ Bosch

Aerosol Jet®

applications at Robert Bosch GmbH

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Aerosol Jet @ Bosch

Introduction of Bosch Corporate Research and Advance Engineering

BMBF* -

Project Polytos

OFET

EU -

Project Interflex

Printed Interconnects for foil-based systems

BMBF* -

Project Ultimum

Printed Interconnects for thin dies

Outlook

Agenda

* Bundesministerium für Bildung und Forschung = German Federal Ministry

of Education

and Research

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Aerosol Jet @ Bosch


BMBF* -

Project Polytos

OFET

EU -

Project Interflex


BMBF* -

Project Ultimum


Outlook

Agenda


of Education

and Research

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Corporate Research and Advance Engineering

Facts and Figures

CR2010

Total expenditures

in millions of euros 227

There of public funding in millions of euros 15

Associates 1,200

thereof scientists and engineers as percentage 80

PhD-

& diploma candidates 94 / 80

Activities

Number of Projects and services

for Bosch divisions and public-sector grants 240

Number of cooperations

with academic institutions >250

Number of submitted inventions of CR Associates 1,157

4

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Corporate Research and Advance Engineering

CR-Sites

worldwide

HildesheimSystems

GerlingenApplied

Research

SchwieberdingenProduction

technology Systems

WaiblingenPlastics engineering

Palo

Alto, PittsburghResearch and Technology CenterNorth America (CR/RTC-NA)

Singapur,Shanghai, Tokio Research and Technology Center Asia/Pacific(CR/RTC-AP)

St. PetersburgResearch and Technology Center Russian Federation (CR/RTC-RU)

5

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CR/APP Plastics Engineering

Bosch Competence Field PE (Plastics Engineering)

Technology Segments

1 (CR/APP1)

High Performance Thermoplastics and Thermosets, Injection Molding Technology

2 (CR/APP2)

Design and Dimensioning of Components, Reliability, Prediction of Lifetime

3 (CR/APP3)

Characterization of Materials, Microstructure and Failure Cause Analysis, Elastomers

4 (CR/APP4)

Electronic Packaging, Reactive Resins

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CR/APP Plastics Engineering

Focus Topics

Electronic Packaging,Adhesion

Technology

Polytronics,Adaptronics

Polytronics

Technology development for flexible electronics

Printed and organic electronics

Electro-active polymers for wave energy harvesting

Electronic Packaging

TIM**

Transfer molding (resistance to high temperatures)

CoC*** Adhesion Technology

Adhesive bonds for injection valves, gels for exhaust gas sensors

Electronic Packaging, Reactive Resins

Technology Segment 3 (CR/APP4)

Cross-section Topics

Application consulting, prototyping

Standardization of reactive resins

* as of January 1st, 2011 ** TIM = Thermal Interface Materials *** CoC

= Center of Competence

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BMBF -

Project Polytos

Requirements of printed electronics

Focus on: smart-labels

Integrated System that includes: sensors, conductive paths, memory,power source, interface, periphery and software

To get e.g. labels for the monitoring of sensitive products

Low cost

customized design and functionality

recyclable

Source: Organic Electronics Association

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Aerosol Jet @ Bosch


BMBF* -

Project Polytos

OFET

EU -

Project Interflex


BMBF* -

Project Ultimum


Outlook

Agenda


of Education

and Research

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Aerosol Jet @ Bosch

Printed Organic SystemsProject Acronym:

Polytos

Duration:

36 Months + 24 Months

Project start:

01.03.2009

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Aerosol Jet @ Bosch

Project Structure

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BMBF -

Project Polytos

Project Goals

Build up of a (conventional) printed top-gate OFET

Develop sensor and circuit concepts

Discover possible applications for printed OFET’s

First tests on OFET reliability

The first step was to print new developed organic semiconductors

and dielectrics

First tests were done on DoD* Systems

* DoD: Drop-on-Demand

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BMBF -

Project Polytos

Results DoD

printing

The drop size of DoD

printed structures lead to thick and rough surfaces

Aerosol Jet System was implemented into a custom designed production cell

The ink development for the PA started in 2011 (atomizing versus polymer compatibility)

First inks were printed on silicon substrate to optimize the ink and to test the performance

Tests with Ag inks for Source-Drain and Gate are planed in 2012

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Aerosol Jet @ Bosch


BMBF* -

Project Polytos

OFET

EU -

Project Interflex


BMBF* -

Project Ultimum


Outlook

Agenda


of Education

and Research

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EU -

Project Interflex

Advancing IntegrationTechnology driven Application driven

Flexible / ConformableRigid

IC

Heterogeneous Integration, Large Area Electronics

System-in-FoilPWB

Source: Institute for Microelectronics, Stuttgart, Germany

PV, TFB

Antenna

(OTFT)-Sensors / Biosensors

OTFTsICs

Higher Packaging Density

PolytronicsSource: FhG-IZM

Source: T. Löher, et. al., ESTC2010, Sept. 13-26, Berlin

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T

r.h.

CO2

dew

Project Acronym:

Interflex (www.project-interflex.eu)

Duration:

36 Months

Project start:

01.01.2010

Interconnection Technologies for Flexible Systems

EU -

Project Interflex

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EU -

Project Interflex

Project Objectives

Development of reliable assembly and interconnection technologies

for foil based

electronic systems:

Interconnection technologies between flexible components and flexible foils

as well as between functional foils.

Three dimensional functional foil integration to achieve multi-foil based

systems, i.e. system-in-foil.

Demonstration of the developed technologies with an energy autonomous, indoor air quality sensing system capable of wireless communication of the measured data.

Bendable

to a bending radius of ½

its maximum dimension

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EU -

Project Interflex

Conformable Electronics based on System-in-Foil

www.project-interflex.eu

Battery

StandardisedInterfaces

Lamination

Power management

Antenna

SensorsTR.H.

CO2DewμC

Tx

IC

ICWiring

layer

Conformable

Energy

Sensing

Communication

Photo-voltaics

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Integration of Sensors

EU -

Project Interflex

Jetting of ICA from Sensor to Substrate Pad

Lamination of Sensors on

Substrate with Acrylic Film

Underfillling

of Sensor to reduce

step

Pick&Place

of Sensors

Aerosol Jetting from Sensor-

terminals to Pads on wiring layer

Singulated

Sensors



Pick&Place

of Sensors

Jetting of ICA into vias



Pick&Place

of Sensors

Drilling of vias

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Aerosol Jet @ Bosch

Aerosol Jet ®

System at Bosch

Optomec pneumatic, ultrasonic atomizer and Head integrated in a Infotech

IP-520 production cell

Possibility of jetting, dispensing and pick and place in one cell

Flexible Software

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Aerosol Jet @ Bosch


BMBF* -

Project Polytos

OFET

EU -

Project Interflex


BMBF* -

Project Ultimum


Outlook

Agenda


of Education

and Research

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BMBF –

Project Ultimum

Advancing Integration

SOC -> SiP

-> SOP

Integration of passives and ICs into PCB

Integration heterogenic Systems (HF, Opto, SiP…)

Increase of packaging density necessary

Quelle: RCP, GoergiaTech

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Project Acronym:

Ultimum

Duration:

36 Months

Project start:

01.08.2010

BMBF –

Project Ultimum

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BMBF –

Project Ultimum

Project Goals

Increase of packaging density -> embedding of actives and passives

Production of thin Dies (thickness: 10-20 μm)

Alternative technology for PCB

Develop the handling (pick and place) for thin silicon chips

Develop a contacting method for thin silicon chips

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BMBF –

Project Ultimum

Handling of thin dies

Pick and Place of the thin Dies actual developed

First samples with NCA Process contacted and tested

Further steps for Aerosol Jet contacting planned

No step reduction like shown in the Interflex Project necessary

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Contacting

Process

with

Aerosol Jet

BMBF –

Project Ultimum

1. Bare Die with

contact

pads

(noble metal)3. Placement

of thin

Die2. Dispensing

of NCA (or

film DA)

4. Curing

of NCA

Q

5. Jetting

of conductive

Ink6. Curing

of conductive

Ink

Q

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Aerosol Jet @ Bosch


BMBF* -

Project Polytos

OFET

EU -

Project Interflex

Printed Interconnects for foil based systems

BMBF* -

Project Ultimum


Outlook

Agenda


of Education

and Research

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Aerosol Jet @ Bosch

Outlook

Further Projects on printed electronics planed

Polytos Phase II

Internal resulting Projects for Interflex and Ultimum

planned

Activities of printed Molded Interconnected Devices planned

Goal is galvanic free MID’s

Advantage: higher System density, reduction of production steps,

higher flexibility

Challenges: reliability over lifetime, Ink-Surface interaction

Polytronik

2. GenerationSensorik

2011 2015 2018

ÖgP

Polytos im Cluster„Forum Organic

Electronics“

1

20132009 2010

Polytronik

3. GenerationOrganische Schaltungen

Polytronik

1. GenerationFolienintegrierte Systeme

Aerosol Jet® applications at Robert Bosch GmbH AgendaAgendaFacts and Figures CRCR-Sites worldwideBosch Competence Field �PE (Plastics Engineering)Foliennummer 9Requirements of printed electronicsAgendaPrinted Organic SystemsProject StructureProject GoalsResults DoD printingAgendaAdvancing IntegrationFoliennummer 18Foliennummer 19Conformable Electronics based on System-in-FoilFoliennummer 21Aerosol Jet ® System at BoschSensor BondingAgendaAdvancing IntegrationFoliennummer 26Project GoalsHandling of thin diesContacting Process with Aerosol JetAgendaOutlook

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