InvenSense 7-Axis Combo Sensor - System Plus Consulting · ©2017 System Plus Consulting |...

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

InvenSense 7-Axis Combo SensorHigh performance IMU with barometric pressure sensorMEMS report by Stéphane ELISABETHSeptember 2017

mailto:[email protected]

mailto:[email protected]

http://www.systemplus.fr/

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 3o Executive Summaryo Reverse Costing Methodology

Company Profile 6o InvenSense

Physical Analysis 11

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Package 14

Package Views & Dimensions

Package Opening

Wire Bonding Process

Package Cross-Section

o Pressure Sensor Die 23 View & Dimensions Details Views Deprocessing & Marking Delayering & Main Block ID Process Cross-Section (Substrate, Metal Pad, Cavity, TSVs)

o ASIC/MEMS Die 56 View, Dimensions & Marking MEMS Removed

o MEMS Die 62 MEMS Sensing Area Detailed MEMS Gyroscope & Accelerometer MEMS Cap

o ASIC Die 92 Overview Delayering & Main Blocks ID Die Process Cross-Section (ASIC, Sensor, Cap & Sealing) Process Characteristics

Physical Comparison with MP67B, ICM-30630 & iPhone 7 Plus OIS IMU 121

Manufacturing Process Flow 127o Global Overviewo Pressure Sensor ASIC Front-End Processo Pressure Sensor ASIC Wafer Fabrication Unito Pressure Sensor MEMS Process Flowo IMU ASIC Front-End Processo IMU MEMS/ASIC Wafer Fabrication Unito IMU MEMS Process Flowo Packaging Process Flowo Package Assembly Unit

Cost Analysis 148o Synthesis of the cost analysiso Yields Explanation & Hypotheses

o IMU MEMS/ASIC Die 153 ASIC Front-End Cost MEMS Front-End Cost ASIC/MEMS Assembly Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost

o Pressure Sensor Die 161 ASIC Front-End Cost MEMS Front-End Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost

o Component 168 Back-End : Packaging Cost Back-End : Final Test Cost Component Cost

Estimated Price Analysis 172

Company services 176


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost andselling price of the ICM-20789 7-Axis Combo Sensor supplied by InvenSense.

• The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axisgyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in thesame package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizesboard area requirements.

• The pressure sensor’s MEMS capacitive architecture provides the industry’s lowest noise at the lowest power.Combined with the motion-tracking 6-axis inertial sensor in a small footprint, the device is ideal for a wide range ofmotion tracking applications.

• The inertial MEMS sensor is fabricated with a minimal number of masks and is directly assembled on theapplication-specific integrated circuit (ASIC) by eutectic bonding. Using knowledge obtained by acquiringSensirion’s pressure sensor division, InvenSense was able to design its own pressure sensor. The device is shippedin a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.

• This report includes a detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. Acomparison with the previous generation of combo sensors from InvenSense is also included in the report.


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology


Physical Analysis

Physical Comparison


Cost Analysis


About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

Reverse Costing Methodology


Overview / Introduction


Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison


Cost Analysis


About System Plus

Synthesis of the Physical Analysis





Physical Comparison


Cost Analysis


About System Plus

Package View & Dimensions

4.0 mm

4.0

mm

1.3

7 m

m

• Package: LGA 24-pin

• Dimensions: 4.0 x 4.0 x 1.37 mm

• Pin Pitch: 0.5 mm

• Marking:

IC2789E

AK559LA1

1722

Package Top View©2017 by System Plus Consulting

Package Bottom View©2017 by System Plus Consulting

Package Side View©2017 by System Plus Consulting





Physical Comparison


Cost Analysis


About System Plus

Package Opening





Physical Comparison


Cost Analysis


About System Plus

Package Cross-Section





Physical Comparison


Cost Analysis


About System Plus

Pressure Sensor – Die View & Dimensions





Physical Comparison


Cost Analysis


About System Plus

Pressure Sensor – Die Details





Physical Comparison


Cost Analysis


About System Plus

Pressure Sensor – Die Cross-Section – TSVs





Physical Comparison


Cost Analysis


About System Plus

Pressure Sensor – Die Cross-Section – Sensor





Physical Comparison


Cost Analysis


About System Plus

IMU 6-Axis – Die View & Dimensions





Physical Comparison


Cost Analysis


About System Plus

IMU 6-Axis – MEMS Sensing Area – Gyroscope





Physical Comparison


Cost Analysis


About System Plus

MEMS Die Cross-Section – Sealing




Physical Analysis

Physical Comparison o Packageo ASIC Dieo MEMS Die


Cost Analysis


About System Plus

Comparison with MP67B, ICM-30630 & 6-Axis IMU in iPhone 7 Plus




Physical Analysis

Physical Comparison

Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis


About System Plus

Pressure Sensor MEMS/ASIC Front-End Process Flow




Physical Analysis

Physical Comparison


Cost Analysis


About System Plus

Pressure Sensor MEMS – Sensor Process Flow 1/3




Physical Analysis

Physical Comparison


Cost Analysis


About System Plus

MEMS Front-End Process Flow




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die

Costo Pressure sensor Wafer &

Die Costo Back-End Costo Component Cost


About System Plus

ASIC/MEMS Wafer & Die Cost




Physical Analysis

Physical Comparison






About System Plus

Pressure Sensor ASIC Front-End Cost




Physical Analysis

Physical Comparison






About System Plus

Pressure Sensor Wafer & Die Cost




Physical Analysis

Physical Comparison






About System Plus

Component Cost




Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

InvenSense 7-Axis Combo Sensor Estimated Manufacturer Price


COMPANYSERVICES




Physical Analysis

Physical Comparison


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis

Physical Comparison


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

InvenSense 7-Axis Combo Sensor - System Plus Consulting · ©2017 System Plus Consulting |...

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