Ni htNicht-ktillDitikkonventionelle Diagnostik von Prozessplasmen€¦ · Institut für...

Institut für Experimentelle und Angewandte Physik

Institute for Experimental and Applied Physics

Ni ht k ti ll Di tikNicht-konventionelle Diagnostik von Prozessplasmen

H. Kersten, H. Maurer, M. Wolter, T. Trottenberg, M. Stahl, V. Schneider

R. Basner*, G. Thieme*, R. Wiese*

IEAP, Universität Kiel, *INP Greifswald

Frühjahrssitzung des AK Plasma

Name des Vortragenden Vortragstitel DatumGroup Plasma Technology

Kiel, 26.05.2009

Institut für Experimentelle und Angewandte PhysikInstitute for Experimental and Applied Physics

contents

introduction

measurement of energy fluxes

particles as electrostatic probesparticles as electrostatic probes

particles as thermal probesp p

summary

Name des Vortragenden Vortragstitel DatumH. Kersten Non-conventional plasma diagnostics 26.05.2009


introduction plasma diagnostics

Experiment, Diagnostics Modeling, Simulation

Plasma

● Kinetics, electrons● Diagnostics

• plasma

● Fluid models , heavy particles● Hybrid models

PIC MCC• plasma boundary / sheath• plasma wall interaction

● PIC-MCC● Global models (Yasuda parameter)

Surface, interface, thin film

● In situ: Ellipsometriy FTIR ● Adsorption MCC● In situ: Ellipsometriy, FTIR, …● Ex situ: Surface analysis (XPS…)

● Adsorption, MCCParticle flows, Sticking-coefficients, Chemical sputtering, …

Name des Vortragenden Vortragstitel Datum

p g● MD-Simulation

H. Kersten Non-conventional plasma diagnostics 26.05.2009


introduction plasma diagnostics

L i b

methods for plasma diagnostics

Langmuir probes

SEERS

ti l t ( i i b ti LIF)optical spectroscopy (emission, absorption, LIF)

photometry of plasma sheath *

t t / l it imass spectrometry / plasma monitoring

V-I-probe

microwave diagnosticsmicrowave diagnostics

energy flux measurement *

micro size particle probes *micro-size particle probes *

etc. etc. etc.

* non conventional“ plasma and sheath diagnostics


* „non-conventional plasma and sheath diagnostics



energy influx energy balance

N.Hershkowitz et.al. (JVST A11(1993)4, 1283 and ISPC-12, 1995, 533.) :“... plasma processing characteristics are similar ... when only a limited number

of plasma parameters are identical at the plasma wafer sheath boundaryof plasma parameters are identical at the plasma-wafer sheath boundary. Identical values of energy flux and particle concentration result in identical rates.”

PSI at LPPP is affected by :PSI at LPPP is affected by :

• energy (E) of impinging particles (energy transfer)• particle flux density(j) towards the substrate (momentum transfer)particle flux density(j) towards the substrate (momentum transfer)

energy influx (J)temperature of the substrate surface (TS)

thermal (energetic) conditions at substrate surface atplasma processing determine

• elementary processes (adsorption, diffusion, desorption ...)• chemical reactions (CSP, SFR ...)• composition (stoichiometry ...)


• structure (morphology, crystal orientation ...)



energy influx energy balance

contributions of energy influx at substrate surface :

• irradiation (plasma, walls, sources) (p )• kinetic energy of charge carriers (electrons, ions)• energy of neutrals (kinetic energy, excitation energy,

heat of adsorption, condensation, resp.)heat of adsorption, condensation, resp.)• exothermic chemical reactions• recombination (charge carriers, atoms)• external hating• external hating

• radiation (environment)energy losses at substrate surface :

• radiation (environment) • heat conduction and convection (substrate holder, gas)• desorption

endothermic chemical reactions• endothermic chemical reactions• sputtering of particles and secondary electron emission• external cooling

H Kersten H Deutsch H Steffen G M W Kroesen R Hippler


H. Kersten, H. Deutsch, H. Steffen, G.M.W. Kroesen, R. Hippler,“The energy balance at substrate surfaces during plasma processing“,Vacuum 63 (2001) 385–431.


“ l “ (Q >0) QQh tH⋅ )( “ l ff“ (Q 0) b⋅H cool Q( )

⋅ QHQ

“plasma on“: (Qin >0) outinS QQheatH −=)( “plasma off“: (Qin=0) by = −H cool QS out( )

+= outSin QHQ

⋅=⋅dt

dTmcH SS dt

ig, 0

8.09

.200

3.K

., B

raun

schw

ei

SS dTdTmccoolHheatHQ ⎬⎫

⎨⎧

⎟⎞

⎜⎛−⎟

⎞⎜⎛=⋅−⋅= )()(


H

energy influx ~ [(dT/dt)heat - (dT/dt)cool ]TTenvcoolheatSSin dtdt

mccoolHheatHQ⎭⎬

⎩⎨ ⎟

⎠⎜⎝

−⎟⎠

⎜⎝

=−= )()(



energy influx thermal probe

40

45

Sondentemperaturin Abhängigkeit von der Zeit

calibration of thermal probe :laser radiation, electron beam

30

35

Laser 1,0 W Laser 0,5 W Laser 0,2 W

mpe

ratu

r [C

°]

0 10 1 20 2 30 320

25

Tem

0 5 10 15 20 25 30 35

Zeit [s]

7

Energieeinstrom durchLaser Millennia V

Nd:YVO diode pumped

4

5

6

Energieeinstrom durch Laserbestrahlung in Luft

om [J

cm

-2s-1

]

Nd:YVO4 , diode pumped532nm (0.1 ... 5W)

0

1

2

3

Ener

giee

inst

r


0,0 0,2 0,4 0,6 0,8 1,00

Strahlungsleistung [W]thermal probe



energy influx rf-plama

M.Wolter, M.Stahl, H.Kersten, “Spatially resolved thermal probe measurement for the investigationof the energy influx in an rf-plasma”,V 83 (2009) 768 772


Vacuum 83 (2009) 768–772.


energy influx rf-plama



energy influx HiPIMS

-4

-10

-8

-6

sitio

n [c

m]

136,5163,0189,5216,0242,5269,0

6 4 2 0 2 4 6-16

-14

-12

axia

l pos

57,0083,50110,0

,

D.Lundin, M.Stahl, H.Kersten, U.Helmersson,


-6 -4 -2 0 2 4 6radial position [cm]

“Thermal flux measurements in high power impulse magnetron sputtering”,J. Phys. D: Appl. Phys., in print.


forces on micro-particles in plasma sheath

Vpl, nn, ne, ni, kTn, kTe, kTiplasma bulk

vi sheath boundaryions

E radius = a d h

Fel Fth

sheath E ad us a

charge = Zd e0

z0

dsh

F FizFg Fi

Telectrode

rf powered electrode

S.V. Vladimirov, K. Ostrikov, A.A. Samarian, ”Physics and Applications of Complex Plasmas”


Physics and Applications of Complex Plasmas , (Imperial College Press, 2005).



dust particles as electrostatic micro-probes

asymmetric rf plasma PerPlEx




z

dsh

rz0

rfat positions, where Fges = Σ Fx = 0, the particles are confined

variation of pressure (density, E-field)



interaction plasma - particles

Fg ~ a3 Fel ~ aE Fn ~ a3(vD-vn)dust cloud

N]

Fel,2

FFion ~ a2vi

2 Fth ~ a2 T

forc

e [N

Fth

FionFel,1

electrode

Fgwall (1) : E = 100V/m

sheath (2) : E = 104V/m

particle radius [µm]

sheath (2) : E = 104V/m1. gravitation2. neutral drag force (viscosity) 3. ion drag force 4. electrostatic force (E-field)5. thermophoresis (temperature gradient) 6. photophoresis (radiation)

forceson dust particles


7. inter grain force (Coulomb)p



micro-particles in plasma sheath in front of rf-electrode

variation of particle mass (charge)

bulk plasmaSub-micron dust cloud

sub-micron particles

2.00 micrometer dust3.04 micrometer dust3 87 micrometer dust ( z )

sheath edge ( dsh )

Levitation Height

3.87 micrometer dust ( z0 )4.89 micrometer dust

6.76 micrometer dust

powered electrode

probing of the plasma sheath (E-field at different heights)


A.A. Samarian, B.W. James, Plasma Phys. Control. Fusion 47(2005), B629.



micro-particles as electrostatic probes

7 07,17,27,37,4

9.55 µm 10.20 µm12.50 µm

6 56,66,76,86,97,0 µ

sitio

n [m

m]

6,06,16,26,36,46,5

trapp

ing

pos

p = 8 PaVbias = -50 … -200 V

a = 4.775 µm-200 -180 -160 -140 -120 -100 -805,65,75,85,9

bias voltage [V]

p = 8 Pa, Vbias = -82 … -200 V

bias voltage [V]

particle (a = 4 775 µm) trapping

variation of bias voltage (E-field)

particle (a = 4.775 µm) trappingin PerPlEx at 8 Pa Argon




PULVA-INP




200

250

]

150

200

emis

sion

[ ct

s

3,953 mm

1,668 mm0 mm

matchingnetworkRF-generator (13,56 MHz) 0 200 400 600

100

ti l iti [ i l ]

14 particles25 particles50 particles

CCD-cameraparticleinjection

A (0 1 100P )d 0 8

1,0

Ar - Plasma P=10 W

+

vertical position [ pixel ]

Laser (532 nm)

Ar(0,1-100Pa)

Langmuir probe

powered electrode

0,4

0,6

0,8

curr

ent [

AU

]

pAr [ Pa ] 10 5 1

Ar+

plasma parameters in PULVA-INPM. Tatanova, G. Thieme, R. Basner, M. Hannemann, Y B Golubovskii H Kersten

plasma monitor

adaptive electrode

microparticle

0 5 10 15 20 250,0

0,2

ion

ion enenergy [ eV ]

Y. B. Golubovskii, H. Kersten, “About the EDF formation in a capacitively coupled argon plasmaPlasma Sources Sci. Technol. 15(2006), 507.


electrode ion enenergy [ eV ]




30

35

40

y f [

Hz

] f(z) = az + b

10

15

20

25 }}

1,1μm4,86μm

ance

freq

uenc

y

1,0Pa2,5Pa9,62μm

}1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6 2,8 3,0 3,2

0

5

10

reso

na

vertical position z [ mm ]

, 5,0Pa 7,5Pa 10PaPRF=10W, parameter: Ar-pressure

3,0

3,5

m ]


250

2,0

2,5

posi

tion

z [ m

0,545μm 1,100μm 4,860μm 9,620μm

plasma emission

200

ion

[ cts

]

3,953 mm

1 668 mm

1,0

1,5ve

rtica

l p

PRF=10W, parameter: particle size100

150 e

mis

si

14 particles 25 particles 50 particles

1,668 mm

0 mm


0 2 4 6 8 10

Ar-pressure pAr [ Pa ]0 200 400 600

vertical position [ pixel ]




Basner, R., Sigeneger, F., Loffhagen, D., Schubert, G., Fehske, H., Kersten, H.,Particles as probes for complex plasmas in front of biased surfaces”


„Particles as probes for complex plasmas in front of biased surfaces ,New J. Phys. 11(2009), 013041




-2500

0

) [ V

m-1 ]

13000

-10000

-7500

-5000

eld

stre

nght

E(z

)

0V -20V -40V

60V

80009000

100001100012000

char

ges

1,0Pa 2,5Pa 5,0Pa 7,5Pa

10Pa0 1 2 3 4 5 6

-15000

-12500

Prf=10W, Ar-Druck 10Pa, parameter: bias voltageelec

tric

fie -60V

2500

0

Vm

-1 ]

30004000500060007000

elem

enta

ry c 10Pa


-7500

-5000

-2500

0V -20V

stre

ngth

E(z

) [ V

0 1 2 3 4 5 6 7 8 9 100

10002000

particle diameter d [ µm ]

Prf=10W, parameter: Ar-pressure

-15000

-12500

-10000 -40V -60V

Prf=10W, Ar-pressure 5Pa, parameter: bias voltageelec

tric

field

sparticle diameter d [ µm ]


0 1 2 3 4 5 6





SMART 1

ARTEMIS


RIT 10




• investigation of the influence of an external ion beam

th ff t f h i b i th f ld• the effect of such an ion beam is threefold :

# change of the sheath structure and the electric field. (plasma density in trapping region),(p y pp g g )# re-charging of the dust particles (additional positive ion supply), # variation of the ion drag force (Coulomb interaction, momentum transfer)

• Ar, 2.2 Pa• rf-plasma, 5 W• large ring, SiO2 ~1µm

ti l i j ti

• Ar, 2.2 Pa• rf-plasma, 5 W• large ring, SiO2 ~1µm• ion beam on / off 200 V• particle injection • ion beam on / off, 200 V

Kersten,H.,et.al.Surf. Coat. Technol.173 174(2003) 918


173-174(2003), 918.



PULVA2



particles in external ion beamparticles in external ion beam(PULVA2)

5mm

500mm

5mm25mm

0,04

0,05

0,06

0,07

ux (J

/cm

²s)

0,00

0,01

0,02

0,03

ener

gy in

flu


-6 -4 -2 0 2 4 6

radial distance (mm)




p = 0.1 PaVbeam = 0 V

p = 3 PaVbias = 146 V

Fel Fg

beam tube closed, no ion beam


gravity (Fg) + electrostatic field force (Fel)H. Kersten Non-conventional plasma diagnostics 26.05.2009





Fn

FgFel

beam tube open, no ion beam


Fg + Fel + neutral drag (Fn(p1))H. Kersten Non-conventional plasma diagnostics 26.05.2009




Fn


n

FgFel

beam tube open, no ion beam


Fg + Fel + neutral drag (Fn(p2))H. Kersten Non-conventional plasma diagnostics 26.05.2009



p = 0.1 PaVbeam = 1300 V

FnFion


Fn

FgFel

beam tube open, ion beam onprobing the drag (ion beam thrusters) H. Kersten, R. Wiese, H. Neumann, R. Hippler,“Interaction of ion beams with dusty plasmas”,Plasma Phys. Control. Fusion 48(2006), B105.


Fg + Fel + Fn + Ionenreibung (Fion)H. Kersten Non-conventional plasma diagnostics 26.05.2009



in equilibrium (rf Plasma + ion beam) : F = F + F Q ~ 600e

variation of beam voltage

NgrmgFg153 101,7

34 −⋅=== ρπ

in equilibrium (rf-Plasma + ion beam) : Fel = Fion + Fg Q ~ 600e0

sh

bias

dVEE ≈= 0)0(01)( E

dzzEsh

⎟⎟⎠

⎞⎜⎜⎝

⎛−=

Vbeam [V] 0 700 800 900 1000 1100 1200 1300 1400

Vbias [V] 100 100 100 100 100 100 100 100 100

⎠⎝

dsh [mm] 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5 5,5

E0 [V/m] 1,8 104

1,8 104

1,8 104

1,8 104

1,8 104

1,8 104

1,8 104

1,8 104

1,8 104104 104 104 104 104 104 104 104 104

z [mm] 5,4 5,26 5,26 5,07 4,93 4,93 4,93 4,79 4,5

E(z) [V/m] 327 785 785 1407 1865 1865 1865 2324 3273

Fel [N] 8 10-15

1,9 10-14

1,9 10-14

3,4 10-14

4,5 10-14

4,5 10-14

4,5 10-14

5,6 10-14

7,9 10-14

Fion [N] 0 1,1 1,1 2,6 3,7 3,7 3,7 4,8 7,1


ion [ ]10-14 10-14 10-14 10-14 10-14 10-14 10-14 10-14




Viktor Schneider,Diplomarbeit 2009



dust grains as thermal probes



particles as thermal probes

Maurer, H., Basner, R., Kersten, H.,Measuring the temperature of micro particles in plasmas“


„Measuring the temperature of micro-particles in plasmas“,Rev. Sci. Instr. 79(2008), 093508.



summary

• detailed knowledge of plasma-surface interaction is necessary for optimizingplasma processes (thin film deposition powder modification)plasma processes (thin film deposition, powder modification)

• thermal probe measurements provide information on PSI

• interaction with micro-particles can also be used as a diagnostic tool(magnetron, rf, ion beam …)

• by observing the position and movement of the particles in dependence on thedischarge parameters, informations are obtained on the electric field in front ofsurfaces and on sheath structure

• by determining the particle equilibrium temperature, informations on energyfluxes are obtained


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