©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr

InvenSense 7-Axis Combo SensorHigh performance IMU with barometric pressure sensorMEMS report by Stéphane ELISABETHSeptember 2017

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 2

Table of Contents

Overview / Introduction 3o Executive Summaryo Reverse Costing Methodology

Company Profile 6o InvenSense

Physical Analysis 11

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Package 14

Package Views & Dimensions

Package Opening

Wire Bonding Process

Package Cross-Section

o Pressure Sensor Die 23 View & Dimensions Details Views Deprocessing & Marking Delayering & Main Block ID Process Cross-Section (Substrate, Metal Pad, Cavity, TSVs)

o ASIC/MEMS Die 56 View, Dimensions & Marking MEMS Removed

o MEMS Die 62 MEMS Sensing Area Detailed MEMS Gyroscope & Accelerometer MEMS Cap

o ASIC Die 92 Overview Delayering & Main Blocks ID Die Process Cross-Section (ASIC, Sensor, Cap & Sealing) Process Characteristics

Physical Comparison with MP67B, ICM-30630 & iPhone 7 Plus OIS IMU 121

Manufacturing Process Flow 127o Global Overviewo Pressure Sensor ASIC Front-End Processo Pressure Sensor ASIC Wafer Fabrication Unito Pressure Sensor MEMS Process Flowo IMU ASIC Front-End Processo IMU MEMS/ASIC Wafer Fabrication Unito IMU MEMS Process Flowo Packaging Process Flowo Package Assembly Unit

Cost Analysis 148o Synthesis of the cost analysiso Yields Explanation & Hypotheses

o IMU MEMS/ASIC Die 153 ASIC Front-End Cost MEMS Front-End Cost ASIC/MEMS Assembly Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost

o Pressure Sensor Die 161 ASIC Front-End Cost MEMS Front-End Cost MEMS Front-End Cost per process steps Total Front-End Cost ASIC/MEMS Back-End 0 : Probe Test & Dicing Wafer & Die Cost

o Component 168 Back-End : Packaging Cost Back-End : Final Test Cost Component Cost

Estimated Price Analysis 172

Company services 176

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 3

Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost andselling price of the ICM-20789 7-Axis Combo Sensor supplied by InvenSense.

• The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axisgyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in thesame package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizesboard area requirements.

• The pressure sensor’s MEMS capacitive architecture provides the industry’s lowest noise at the lowest power.Combined with the motion-tracking 6-axis inertial sensor in a small footprint, the device is ideal for a wide range ofmotion tracking applications.

• The inertial MEMS sensor is fabricated with a minimal number of masks and is directly assembled on theapplication-specific integrated circuit (ASIC) by eutectic bonding. Using knowledge obtained by acquiringSensirion’s pressure sensor division, InvenSense was able to design its own pressure sensor. The device is shippedin a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.

• This report includes a detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. Acomparison with the previous generation of combo sensors from InvenSense is also included in the report.

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 4

Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

Reverse Costing Methodology

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 5

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Synthesis of the Physical Analysis

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 6

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Package View & Dimensions

4.0 mm

4.0

mm

1.3

7 m

m

• Package: LGA 24-pin

• Dimensions: 4.0 x 4.0 x 1.37 mm

• Pin Pitch: 0.5 mm

• Marking:

IC2789E

AK559LA1

1722

Package Top View©2017 by System Plus Consulting

Package Bottom View©2017 by System Plus Consulting

Package Side View©2017 by System Plus Consulting

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 7

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Package Opening

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 8

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Package Cross-Section

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 9

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor – Die View & Dimensions

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 10

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor – Die Details

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 11

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor – Die Cross-Section – TSVs

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 12

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor – Die Cross-Section – Sensor

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 13

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

IMU 6-Axis – Die View & Dimensions

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 14

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

IMU 6-Axis – MEMS Sensing Area – Gyroscope

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 15

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Synthesiso Packageo Pressure Sensor Dieo PS Die Cross-Sectiono ASIC/MEMS Dieo MEMS Dieo ASIC Dieo ASIC/MEMS Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

MEMS Die Cross-Section – Sealing

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 16

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Packageo ASIC Dieo MEMS Die

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Comparison with MP67B, ICM-30630 & 6-Axis IMU in iPhone 7 Plus

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 17

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor MEMS/ASIC Front-End Process Flow

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 18

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

Pressure Sensor MEMS – Sensor Process Flow 1/3

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 19

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Global Overviewo Pressure Sensor Processo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis

Selling Price Analysis

About System Plus

MEMS Front-End Process Flow

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 20

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die

Costo Pressure sensor Wafer &

Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

ASIC/MEMS Wafer & Die Cost

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 21

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die

Costo Pressure sensor Wafer &

Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

Pressure Sensor ASIC Front-End Cost

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 22

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die

Costo Pressure sensor Wafer &

Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

Pressure Sensor Wafer & Die Cost

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 23

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC/MEMS Wafer & Die

Costo Pressure sensor Wafer &

Die Costo Back-End Costo Component Cost

Selling Price Analysis

About System Plus

Component Cost

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 24

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

InvenSense 7-Axis Combo Sensor Estimated Manufacturer Price

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 26

COMPANYSERVICES

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 27

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings

©2017 System Plus Consulting | InvenSense ICM-20789 7-Axis Combo Sensor 28

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 82llevenez@systemplus.fr

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