Post on 19-Mar-2020
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
FraunhoferIZM
Institut Zuverlässigkeit und Mikrointegration
Institutsteil München
Large area cost-efficient electronics integration.“Flexible Substrate – Polytronische Systeme“
Karlheinz BockFraunhofer Institute for Reliability and MicrointegrationHansastr. 27d, D-80686 Munich, Germany, karlheinz.bock@izm-m.fraunhofer.de
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Outline
• Introduction• Plastics Electronics manufactured in Roll to roll (reel to reel)• Performance and Technology Integration• Silicon does not sleep• Micro-Systems in R2R – Smart Plastics• Outview
Artist visionSource Fraunhofer
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Moore‘s Law
Through-Hole Wave
1970 1980 1990 2000 2010
10
100
1000
Syst
em V
olum
ea.
u
Area Array Wave
Surface-Mount Wave
10000
1
2020
PackagingGap
100000
1000000
Hetero SystemIntegration Wave
HDI - Wave
Electronic Systems Packaging Technology Waves
NANO
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Polymers – basic material for future electronics & systems?
substrates and interconnects
transistors and ICs, memory
sensors and aktuators MEMS
Power - batteries and solar cells
Displays, lighting, signage
Packaging and housing
Media connections - fluidics pneumatics...
In-Line Processes Reel to Reel, or sheet
⇒ Complete systems based on most-Polymers
Polytronic Systems pictures: FhG-IAP. FhG-IPMS, FhG-IZM, Power Paper Ltd.
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Flexible Substrates & Large Area ?
• For production reasons– Substrate handling, large volume, – Material efficiency
• Add to existing production processes– Free form factor for final product– In-line integration in end product– Surface integration
• The end product is to be flexible– Reliable & Ruggedized, shatterproof– Thin & rollable, – Wearable & light weight,
Artist view Fraunhofer Journal
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Summary of Process Targets for Large Area Electronics
• Small critical dimension (lithography) channel length
• high yield, higher integration scale
• better reproducibility small variation in FET performance
• good conductive wiring (thin metals) better interconnection
• antenna integration for wireless communication of
ubiqitious systems (RFId, ambient intelligence)
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
What price.... PrIntegrated Circuit
• Resolution of mass printing has to reach <10 μm (now100μm), Registration has also to improve, but not so significantly as compared to resolution
• Material properties like conductivity and mobilityhave to improve by a factor of 10-100 to be able to massprint electrically operational circuits
• Structurization accuracy (d structure / d roughness) has to improve by a factor of 100
• Thickness of mass printed dielectric can only be reducedto <1μm if first two requirements are not reached, because of electrical and geometrical limitations.
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
High Density Interconnect Technology
Waferlevel HDI with integratedThin (20µm) Si Chips and 5µm Cu routing
Processed layers : µmMetal 4 Ni contact pads 10Dielectric 3 PI passivation 20Metal 3 Cu routing 5Dielectric 2 Polyimide 20Metal 2 Cu routing 5Dielectric 1 Polyimide 20Metal 1 Ni contact pads 10Separation Thermoplast 10Mech. Carrier Si-Monitorwafer 520
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Focus of IZM Development
evaporation
small molecules
solvent based
polymer
very low-cost
Sensor networks
large area
display driver
digital processed
end-user electronic
sheets
rolls
wafer
coating process application field manufacturing
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Dimensional Accuracy of Copper Patterning
dimensional accuracydepends on- mask quality- resist process- etching process
dependent on gap to nextstructure
after lithograpyafter etching
-6
-4
-2
0
2
0 25 50 75 100
distance to next pattern [μm]
devi
atio
n[μ
m]
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Development of fine pitch substrates using R2R
• Subtractive and semiadditive processes developed
• Subtractive technique: Only for thin metal layers and/or regular pattern applicableSmall single lines with large distance to next structure should be avoided
• Semiadditive technique:Dry fotoresist DuPont MX5015, thickness 15μmSubstrate: metallized polyimide tape with 1μm CuLimit of pattern resolution corresponds strongly to photoresist thickness with an aspect ratio of ca. 1 ⇒ minimal lines and spaces of ca. 15μm
40μm pitch 30μm
Semiadditive technique, Cu thickness ca. 6μm
SHIFT - IST 507745 Smart High-Integration Flex Technologies
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Second conductor layer by screen printing
screen printed lines crossing Cu lines test sheet 200x200 mm²
• Minimal lines and spaces of first Cu layer: 15μm
• Minimal lines and spaces of printed second layer: 200μm
• Also 50μm via openings show contact between both layers
SHIFT - IST 507745 Smart High-Integration Flex Technologies
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
UV-Lithography
mask alignment
UV exposure
spoolerdespooler
etch unit
resist striprinse
dryerrinse
Reel-to-Reel Application Center - Equipment
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Reel-to-Reel Application Center - Equipment
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Summary: Reel-to-Reel Manufacturing of Polymer Electronics
• All Processes can be done from Roll to Roll
• UV-lithography, blading of OSC, gate isolation , screen print gate conductor, via and interconnect
• Patterning Steps are done in stop&go with 200 mm steps
polymer-FET
coppersubstratesubstrate
gate conductorprintedgate conductorprintedvia
gate dielectricbladedgate dielectricbladed
semicond. polymerbladedsemicond. polymerbladed
copperwet-etchedcopperwet-etched
via openedwith solventvia openedwith solvent
top wiringprintedtop wiringprinted
multilayerdielectricprinted
multilayerdielectricprinted
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Automatised Test Equipment
Reel-to-reel test equipped withsoftware controlled patternrecognition and measurement
Needle probe for device characterization withKeithley parameter analyzer (4 SMUs)
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
• Setup for measurement
-V -V
V
22M
22M
100n
20M
Bode plot flexible OFET SD 40μm
-12
-10
-8
-6
-4
-2
0
2
4
1kHz 10kHz 100kHz 1MHz
Frequency [Hz]
Am
plit
ud
e [
dB
]
Dynamic Behavior of Polymer TFT
process & device performance data see following presentation of G.Klink
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Development of a polymer temperature sensor in Roll to Roll
-R1
R1R2
R2
Sensor circuit
+
-
Temperature threshold discrimination
20 40 60 80 10048
49
50
51
52
53
54
55
Supp
ly v
olta
ge (V
)
Temperature (°C)
output 1 output 2
Selection of a material with positive and a material with negative temperature coefficient allows realisation of the temperature sensor
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Integration of Polymer Electronics to Systems
•Antennae
etched copper printed silver
•Fused ROM for Memory
copperconductortripped bycurrent pulse
•Logic Circuits
layout for a small scale integrated
logic polymer circuit•Encapsulation
y = -0,0006x + 1,0083
92%
94%
96%
98%
100%
102%
0 20 40 60 80 100 120storage time 35°C/85%rH
Measurement of transistordegradation in humid environment
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Differential amplifier – Interface to sensors
Schematics Comparator
Layout
Circuit
Polymer System Integration needs analog-digital interface for sensors
Design, layout and processing finished, device in evaluation
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Ultra Thin Silicon
Technologies for Flexible Electronics
• very thin ICs down to 5μm
• high performance
• flexibel but brittle
• higher functionality on small area
• assembly effort
• advanced electronics applications
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Research project BMBF-ASSEMBLE
• Today‘ssituation:
• Smaller and smaller dies haveto be handled in huge amounts and at extremely lowcosts
• Billions of RFID tags at a price << 5 US centwould benecessaryto enablesingle itemtracking• Development task:
• Eliminate standard pick & place robotics and find new processes whichallow self-assembly and self-interconnection of extremely small chips
Discrete devices
Smart Labels
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Basic principle of a self-assembly process for small dies
Surfacepatterning
Dispense chip in droplet
Self-alignment
Self-interconnection
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Example: Self alignment of a thin test chip in liquid environment
Chip dispensed within a droplet of water
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Principle of mobile electrostatic carrier substrates
Bipolar configuration: electrodes are chargedoppositelyElectrostatic field remainsactive after disconnectingpower supply
Device wafer
+_
Power supply0,2 ... 2 kV
Mobile electrostaticcarrier
Electrostatic force between wafer and carrier:
F = ε U2 A / 8 d2
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Bumping process performed at 50 – 70 μm thin test wafers
mobile ESC Thin wafer on mobile-ESC entering theprinting machine,
Bumping process performed at IZM in Berlin by R. Patzelt and D. Manessis
Thin wafer with NiAu UBM attachedonto mobile electrostatic carrier
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
mobile ESC
Solder ball bumping performed at 55 μm thin test wafersby means of mobile electrostatic carriers
Solder balls: SnAgCu, diameter ca. 140 μm
55 μm
Bumped wafer after solder reflow
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Reel-to-reel (R2R) assembly of thin chip
• FC bond by use of ACA
• Up to now only partially bonded chips achieved
backside view of a partially bonded chip
SHIFT - IST 507745 Smart High-Integration Flex Technologies
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Chip on Cardboard: Contact to ultra-thin ICs
Screen-printed antenna and IC contact
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Printed Isoplanar Contacts on thin ICs (25μm)
Chip 1 x 1 mm2
Daisy Chain with 4 contacts
Chip 2 x 2 mm2
Daisy Chain with 16 contacts
Chip 3 x 3 mm2
Daisy Chain with 36 contacts
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
• Full flexible solution with ultra thin silicon (20μm)
• Cost-effective manufacturing
• with reel-to-reel printing and die bonding
Polytronics Using Flexible Silicon ICs
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Energy-Autarkic Micro Sensor System
Basestation
Receiver for the sensor data
with RS232 Interface
Energy harvesterwith
energy store
Visualisation of thesensor data with a
PC
868Mhz
13,56MHz
Data-transmitter
Microcontroller with
sensor
An Energy-Autarkic Micro Sensor System
mask alignment
UV exposure
spoolerdespoolerRealization of the sensor module in reel-to-reel technology and molding of the sensor
•
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
The measurement of temperature in an automotive application
• Tire parameters:• Temperature, rpm, inflation
pressure,ID, age, heat dissipation, remaining service life
• The tire parameters could be monitoredduring the operation and warn thecar driver if the driving safety is endangered
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
EL Displays, Lighting and Signage
Anorganic electroluminescensematerial in polymer matrixRzR Screen-print (5 layers)Substrate: PET-FolieMounted on acrylic glas panel
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Smart PlasticIntegration of Peripherics with Electronics in Foils
organicDisplaysHuman Maschine InterfaceData output
AnorganicElectronics (Si)High funktionality
organicelectronicsCost-effektivLarge area
Polymer Solar CellsEnergy
Foil SensorsData inputDetectionBio-sensors
Aktuator LayerData outputsystem funktions
Ambient Intelligence
Polytronics
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Micro Systems meets Life Sciences
• Bio-Chip & Diagnostische Systeme, Lab-on-chip, Micro-Opto-Fluidic MOF, Plastik-MEMS
• Implantables, Bio-Compatible, Bio-Interfaces
• Health Care Sensors, Low Power• Fluidics, Sensors, Micro Reactors
Lifetronics -Tools & Components for Biology,Medicine & Pharmaceutics
MOF-structure
Polytronics
Biosystemintegration
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Electrochemical electrodes: design
CECounter
electrode
REReferenceelectrode
WEWorkingelectrode
Design considerations: Area CE >> Area WE(pseudo) RE near WE
Electrodes on glas and plastic
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Printing or
discreteLamination
Lithography(or printing
or embossing)Lamination
Printing or
direct metal
Lamination
or web-coatingor print
Laser to open contacts and ports
and to separate MEMS devices
substrate
Placementof discrete
components
FC discrete
Low-Cost MEMS in R2R
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
substrate
HF Metal1 Inductance
LF Metal2 Inductance
HF chips1
Solarcell – Sensors - Actuators
batterie
CapacitanceResistorOpto-Waveguides
chips2Resistor Capacitance
Low-K
VCSEL
RF
Application: Complex Flexible System Integration and -assembly in Reel-to-Reel
IZM
Fraunhofer Institute Reliability and Microintegration
Polytronic Systems Department - Munich
K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007
Large area cost-efficient organic electronics integration
Large-area multi-functional systems
• distributed over a large area• connected in a network (sensor network), displays• Wearable integrated in clothes and textiles• Autarkic solar, energy scavenging• Bio-medical diagnostics, bandages, implantables• Low-cost systems : e.g. Disposables
• Smart Plastics