Perspektiven der b-Physik file3 Why is CP Violation Interesting ? The Standard Model SU 3 x SU 2 x U...

C. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010 1

Warum ist die „Flavor-Physik“ interessant?

Neue Physik im Flavor Sector?

Physikpotenzial bei Ultrahoher Luminosität

Maschine und Belle II

Zeitplan und Zusammenfassung

Christian KieslingMPI für Physik, München

Perspektiven der b-Physik

2

Surprising Discoveries in Weak Interactions of Quarks

T.D. Lee C.N. Yang 1957

P violated maximallyin weak Interactions.

M. Kobayashi T. Maskawa 2008

O(1) CP violation and 3 generations

J. Cronin V. Fitch 1980

Small CP violation in neutralK system

C. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010

3

Why is CP Violation Interesting ?

The Standard Model SU3 x SU2 x U1 (SM) describes all data so far,

Dark Matter exists (only 4% of the Universe accounted for by SM)

At least two of them have to do with CP Violation

Neutrinos have mass (Dirac, Majorana?)

Baryon Asymmetry in the Universe ismuch too large (by 10 orders of magnitude)

Evidence for Physics beyond the Standard Model:

needvery high energy

(LHC) orvery high precision(Super B factories) CP : One of the so-called Sakharov-conditions

yet: cannot be the correct theory, SM only a „low energy“ approximation


4

The CKM Matrix and the Unitarity Triangle(s)

weak decays of hadrons (quarks change flavor) are described in the SM by the (unitary) CKM matrix

sinC

l q2 3

CKM 2 2

3 2

1 / 2 ( )

1 / 2

(1 ) 1

ud us ub

cd cs cb

td ts tb

A iV V V

V V V V A

V V V A i A

l l l r h

l l l

l r h l

æ öæ ö - - ÷ç÷ç ÷÷ çç ÷÷ çç ÷÷ çº = - -ç ÷÷ ç ÷ç ÷ ÷ç÷ç ÷ç÷ç ÷- - -÷ç ÷çè ø è ø

Cabibbo, Kobayashi, Maskawa

Triangle for K mesons

* * * 0ud us cd cs td tsV V V V V V+ + =

* * * 0ud ub cd cb td tbV V V V V V+ + =

Triangle for B mesons

(almost real)

large angles =large CP



Types of CP Violation in the B-System

B f B f directCP violation

BCPf

BCPf

BCPf

B

BCPf

B

22

2 2mixing-inducedCP violation

„mixing“:

(charged andneutral B mesons)

(onlyneutral B mesons)

bd

bd

t t0B0BW

tdV

0 0

0 0

L

H

B pB qB

B pB qB

= +

= -

( ) ( )H L

m M B M BD = -


Example: Mixing-Induced CP Violation

0 0| ; |CP CPA B A By y= =

0B CPy CPy

0B0B

0B¹A

A

A

CPy : CP eigenstate

pq

qp

0 0

0 0

2

2 2

( ; ) ( ; )( , )

( ; ) ( ; )

1 2 Im( )cos sin

1 1

CPB t B t

tB t B t

m t m ty y

y y

y yy

y y

l l

l l

G D -G DD =

G D +G D

-= D D + D D

+ +

q Ap Ayl =

A

7

z c tbgD = D

The CP Observables: What do we measure?

(4 )S¡HER (e-) LER (e+)

some state , orCP eigenstate, e.g.

flavor eigenstate

/

1S

J K

CP

y=-

0 0( )B B0 0(4 )e e S B B+ - ¡

Asymmetric beam energies: translate decay time to decay length

0 0( )B B

0B bd=B-Mesons:

„B-Factory“

Flavor eigenstate, e.g.*,Xl D Xn

( )f f

„flavor tagging“

the„Golden“ channel


B decay vertexposition of utmostimportance


*

*tb td

tcb cd

V VR

V Vº

*

*ub ud

cb cd

b

V V

V VRº

How do we see the New Physics ?

Standard Model: all 5 measurements must give consistency with the triangle

New PhysicsIf triangle „does not close“

Rare decays, e.g.0 0

0

B K l l

K nn

+ -

b s

ll

NP

unexpectedly „large“ branchingfractions

(0) (1)5 observables to measure:2 sides, 3 angles:

heavily over-determined

b s

ll

SM

„Penguin“


New Physics at the Loop Level ….

NP in CPV asymmetries:

SB Kf

„penguins“

Principle:

Deviation of observable from the SM prediction signals NP

virtual particles in the loopreveal their existence NP

L

/S

B J Ky

SM NP

Rare Decays of B mesons:

,

,

s d

s d

d

s

B X

B X l l

B X

B l l

g

nn

+ -

+ -

( )( )( )( )

4

6

6

9

10

10

10

10

-

-

-

-

need precision (statistics) to challenge the SM

SM pred.leptons:

t mgt mmmt mh

NP couldmake thesedecayspossible

83.5GeV2.1×1034cm-2s-1

B-Factories

PEP-II9GeV(e-),3.1GeV(e+)1.21034cm-1s-1

BABARDetector

4 lyr.

world record !C. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010 10


Luminosity accumulated at Present B-Factories

PEP-IIstopped

30.6.2010: KEKB stopped


Comparison Tree and Penguins for N1 ($)

penguins fromDalitz plotanalysis

tree

penguins from2-body decays

N1 from tree andpenguins (still) consistent

only small contr. from T -> „eff.“

note: Theory would favor 1 1efff f>

b ccs

b sqq penguins


Another Puzzle: Direct CP Violation in B Kp

Nature 452, 332 (2008)

( ) 0CPA K p+ - <WA: 0.098 0.012-

0( ) 0CPA K p+ >WA: 0.050 0.025+

0B 0B

B- B+

- Large color-suppressedtree amplitude?

- Enhanced EW penguin?- New Physics?

should be equal !

14

Energy reach of the Super Flavor Factories

No flavor structure for NP: 100 1000 TeVNP

L ³ -

Look for FCNC processes (highly suppressed in SM):

Assumption on NP flavor sector:Minimal Flavor Violation (MFV)

Measure, e.g., the decay rates:

0 0

0

0

sB X l l

K l l

K nn

+ -

+ -

(inclusive)(exclusive)

.

.

.

.

150 abdt -=ò %é ùê úë û

~2 OoM increase



The Unitarity Triangle in the year 2020

150 abdt -=ò

SM correct present tensions stay …

… the dream !a nightmare …


LHCb vs Super Flavor Factories

LHCb and Super B Fact. will run concurrently. largely complementary

sB oscillations rare B decays, such as

,B l B Kn nn+ + ,b s b sl lg + -

inclusive processes (full reconstruction)

, bottom baryonscB

0 0D D mixing

0,s dB mm

/ , , , ,B J yf pp rp rr ppp

LHCb Super B Factories

/S

B J Ky

large samples, charged particles generally many more final statesesp. with photons, neutrinos

0 ,D K K Kp+ - + - Rare decays of leptons

exclusive processes


4 x y

N N fR

ps s+ -=

( ), 2ye

y yx x y

NrRx

bx

pg s s s-

++

æ ö÷ç ÷ç ÷= ç ÷ç ÷ç ÷+ ÷çè ø

Strategies for High Luminosity @ Super BF’s

basic formula for the (instantaneous) luminosity

Accelerator physicists usually like this one better:

beam-beam parameter(or tune shift)

,12

y y

e x y y

I Rer Rx

s xg

s b+ ++

æ öæ öæ ö ÷ç÷ ÷ ÷ç ç ç÷ ÷ ÷ç ç ç= + ÷ ÷ ÷ç ç ç÷ ÷ ÷ç ç ç÷ ÷ ÷ç çè øè ø ÷çè ø

stored current tune shift

vertical beta function at IP

, , ,x y x y x ys e b=

beam emittance(need damping ring(s))

,R x : reduction factors(geometrical)

,x ys : beam spot sizeat IP


SuperKEKBe-e+

Tunnel already exists.Most of the components (magnets, klystrons,etc) will be re‐used.

e+ 3.7 A

e- 2.1 A

Goal: reach > 8 × 1035 cm-2s-1

4 GeV7 GeV

new ante-chamberbeam pipe

new low-emittanceRF-gun forLER

new damping ringfor HER

new arc lattice forHER

new IR optics

X-angle = 83 mradUpgrade Program:

financed by Japan

50 70 nmy

s = -

Funding Situation of the Machine


Now officially called „SuperKEKB“

KEKB upgrade plan has been practically approved

Final decision expected by the end of this year

19


Belle

“Belle II”

SVD: 4 lyr -> 2 DEPFET layers + 4 DSSD layersCDC: small cell, long lever armACC+TOF -> TOP+A-RICHECL: waveform sampling, pure CsI for end-capsKLM: RPC -> Scintillator +SiPM (end-caps)

new dead time free readout and high speed computing systems

Detector for SuperKEKB: Belle II

7 GeV e-

„backward“ 4 GeV e+

„forward“

CDC

SVD PXD

PID

ECL (CsI (Tl))

KLM („KL µ“, barrel)KLM(endc.)

ECL(CsI)

ECL(CsI)

Very high backgroundsfrom SuperKEKB !!


Belle

“Belle II”

SVD: 4 lyr -> 2 DEPFET layers + 4 DSSD layersCDC: small cell, long lever armACC+TOF -> TOP+A-RICHECL: waveform sampling, pure CsI for end-capsKLM: RPC -> Scintillator +SiPM (end-caps)

new dead time free readout and high speed computing systems

Detector for SuperKEKB: Belle II

7 GeV e-

„backward“ 4 GeV e+

„forward“

CDC

SVD PXD

PID

ECL (CsI (Tl))

KLM („KL µ“, barrel)KLM(endc.)

ECL(CsI)

ECL(CsI)

Very high backgroundsfrom SuperKEKB !!

pixel technology:DEPFET: German invention (MPI)


p-channel FET on a completely depleted bulkinvented at MPI, produced at HLL

A deep n-implant creates a potential minimum for electrons under the gate(“internal gate”)

Signal electrons accumulate in the internal gate and modulate the transistor current (gq ~ 400 pA/e-)

Accumulated charge can be removed by a clear contact (“reset”)

DEPFET Principle

Fully depleted: large signal, fast signal collection

Low capacitance, internal amplification

low noiseTransistor on only during readout:

low power

Depleted p-channel FET

23

Row wise read-out ("rolling shutter mode")

select row with external gate read current, clear internal gate, read current again

the difference is the signal

only one row active low power consumption

three different auxiliary ASICs needed

n x mpixel

IDRAIN

DEPFET- matrix

VGATE, OFF

off

off

on

off

VGATE, ON

gate

drain VCLEAR, OFF

off

off

reset

off

VCLEAR, ON

reset

output

0 suppressionVCLEAR-Control

Array of DEPFETs

Switcher

DCD (drain current digitizer)

DHP (data handling processor)C. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010

SuperKEKB: Nano beam option, 1 cm radius of beam pipe

Significant improvement in z-vertex resolution

2 layer Si pixel detector (DEPFET technology)(R = 1.4, 2.2 cm) monolithic sensorthickness 75 µm (!), pixel size ~50 x 50 µm²

4 layer Si strip detector (DSSD)(R = 3.8, 8.0, 11.5, 14.0 cm)

15m

30m

Belle

Belle II

psin() [GeV/c]0.4 2.00 0.8 1.2 1.6

100

20

50

σ [µm]

SVD

PXD

„PXD“

„SVD“

PXD+SVD

Silicon Tracking System @ Belle II

DEPFET:thin sensor (50 µm)unique worldwide



Full-Size Mockup of the PXD

…with real thinnedSi ladders

DEPFET-Collab. @ Belle IIOriginal Collaboration: DEPFET pixel detector @ ILC (since 2002)now: Unite efforts to deliver a REAL PXD by end of 2013 for Belle II

University of Barcelona, Spain CNM, Barcelona, Spain IHEP Beijing, ChinaUniversity of Bonn (N. Wermes, H. Krüger)University of Heidelberg (P. Fischer, I. Peric) University of Giessen (W. Kühn, S. Lange)University of Göttingen (A. Frey)University of Karlsruhe (T. Müller, M. Feindt)IFJ PAN, Krakow, PolandLudw.-Max.-University, Munich (J. Schieck)Max-Planck-Institute for Physics, MunichTechnical University, Munich (S. Paul)Charles University, Prague, Czech RepublicIFCA Santander, Spain IFIC, Valencia, Spain

DEPFET@Belle II

Management:

Project LeaderC. Kiesling (MPI)

Technical Coord.H.-G. Moser (MPI)

IB- BoardChair: Z. Dolezal (Prag)

Integration CoordinatorShuji Tanaka (KEK)



SuperKEKB and Belle-II 1.7 A e-

1.4 A e+

Belle-II Collaboration founded in Dec. 2008now over 350 members from 47 institutions and 13 countriesstrong European participation:Austria, Germany, Czech Republic,Poland, Spain, Slovenia,(mainly in Pixel Vertex Detector,

Si Strip Detector)

Tsukuba, Japan


Schedule for SuperKEKB and Belle II

First beamsOct. 1, 2014

Official KEK schedule


Zusammenfassung

„Neue Physik“ benötigt, um die beobachtete Materie-Antimaterie-Asymmetrie zu erklären Neue Quellen der CP-Verletzung !

Machine und Detektor fertig zur Datennahme im Herbst 2014

KEK (Japan): „SuperKEKB“ Projekt (+ Belle II) auf gutem Wege:Teilfinanzierung durch Japanische Regierung (100 M$ von 380 M$ )

„Grünes Licht“ für SuperKEKB

Neue Generation von B-Fabriken zur Suche dieser neuen CP geplant„precision frontier“ (komplementär zum LHC Programm)

Substantielle Beiträge aus Europa (Germany!) zum Vertexdetektor PXD mit eigener, einzigartiger DEPFET Technology (gefördert durch BMBF)

Exzellente Perspektiven für die Flavor-Physik, mit hohem Entdeckungspotenzial, auch bei Massenskalen jenseits des LHC


Backup

31

High Current Option includes crab crossing and travelling focus.Nano-Beam Option does not include crab waist yet

Comparison of Options

KEKB Design

KEKB Achieved(): with crab

SuperKEKBHigh‐Current

Option

SuperKEKB Nano‐Beam

Option

y* (mm)(LER/HER) 10/10 6.5/5.9 (5.9/5.9) 3/6 0.21/0.37

x (nm) 18/18 18/24(15) 24/18 2.8/1.6

y(m) 1.9 1.1 (0.84) 0.85/0.73 0.070/0.052

y 0.052 0.108/0.056 (0.101/0.096) 0.3/0.51 0.07/0.07

z (mm) 4 ~ 7 5(LER)/3(HER) 6

Ibeam (A) 2.6/1.1 1.8/1.45 (1.62/1.15) 9.4/4.1 3.70/2.13

Nbunches 5000 1387 (1585) 5000 2778

Luminosity(1034 cm‐2 s‐1) 1 1.76 (2.11) 53 80

Nano-beamchosen



Shutdownfor Upgrade

1.2 /ab/month(8 x1035 /cm2/s)

0.9 /ab/month(6 x1035 /cm2/s)

0.6 /ab/month(4 x1035 /cm2/s)

Learning Curve

PhysicsProgram

Evaluation

50 /ab

Expected Luminosity Development

Japanese fiscal year(start 1.4.).

1.4.2014

35 2 1design 8 10 cmL s- -= ´

2005 2010 2015 2020 2025


sensor wafer

handle wafer

1. implant backsideon sensor wafer

2. bond sensor waferto handle wafer

3. thin sensor sideto desired thickness

4. process DEPFETson top side

5. structure resist,etch backside upto oxide/implant

sensor wafer

handle wafer

1. implant backsideon sensor wafer

2. bond sensor waferto handle wafer

3. thin sensor sideto desired thickness

4. process DEPFETson top side

5. structure resist,etch backside upto oxide/implant

Sensor wafer bonded on “handle” wafer. Rigid frame for handling and mechanical stiffness 50 m thickness produced, 75µm needed for PXD Samples of 10x1.3 cm2 & frame of 1 & 2 mm width Electrical properties tested successfully (diodes)

Thinning Technology

thickness: 0.017 X0

DCD

DHP

DHHSwitcher

~20 cm

10-20 m

Power,Control

Data

TWPPatch-Panel

2 layers: @1.4(2.2) cm


DAQ,Trigger,Timimg

Opt.

PS, Slow control

halfladder:~800rows

250cols

15 x70(85)mm

Pixels: 50 x 50(75) µm

Thickness:75 µm

total of 8 Mpx

readout: 20 µs

Opt.

Cu

PXD Project - Layout

35

Work Package Distribution

Nr. Work Package Lead Institution Collaborators

1.0 DEPFET Modules1.1 Parameter Definitions MPI PRA

1.2 Sensor Development MPI

1.3 ASIC Development1.3.1 Switcher HEI1.3.2 Current Digitizer (DCD)1.3.3 Data Handling Processor (DHP) BON MPI, UBA1.3.4 Interconnection technology BON HEI, USC, URL

1.4 Module Design1.4.1 Sensor Ladder MPI BON, CNM, HEI, IFV,

IFB

1.4.2Gbit‐Link, Kapton Flex, Patch Panel BON LMU. URL

1.4.3 Data Handling Hybrid (DHH) TUM BON, GOE, URL C. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010


Work Package Distribution (cont.)


1.5 Mechanical Design MPI IFV, KAR, KEK, VIE

1.6 Thermal Issues KAR IFB, IFV, KRA, MPI, VIE

1.7 System

1.7.1 Data Acqusition GIEBON, GOE, KEK, KRA, MPI, TUM, URL

(+pre‐event builder)

1.7.2Power supplies with slow control LMU KEK, KRA, USC

1.7.3 Cooling plant KEK IFV, KAR(refigerator, heat exchanger)


Work Package Distribution (cont.)


2.0 Test Facilities

2.1.1 Test beam setup IFV BON, CNM, HEI, IFB, IFC, KAR, URL, VIE,

2.1.2 Test beam analysis PRA BON, GOE, IFV, MPI, USC

2.1.3 Lab test procedures MPI (all)

2.2 Setups for thermal tests KAR IFC, IFV, MPI, VIE

2.3 Mechanical mockup KAR IFV, MPI

2.4 Irradiation Tests MPI BON, KAR

2.5 Full System Test MPI all


3.0 Integration and running‐in3.1 Installation in Tsukuba Hall

3.2 Slow controls, calibration

3.3 Radiation monitor(also during machinecommissioning and run‐in )

MPI

3.4 Roll into beamline


Work Packages Mostly Uncovered

39

New Tracking System for Belle II

Belle

Belle-II


40

00

10

34

56

[cm] layers

[cm]

20

-10-20-30 10 20 30 40

6

64

44 4

46

6

66

64

44 4

44

46

666 6

6 6 6

6

Layer # Ladders

Rect. Sensors[50μm]

Rect. Sensors[75μm]

Wedge Sensors

APVs

6 17 0 68 17 8505 14 0 42 14 5604 10 0 20 10 3003 8 16 0 0 192

Sum: 49 16 130 41 1902

New Si System for Belle II : SuperSVD

300 µm DSSD

Pitch:50/160 µm (rect.)50-75/160 µm(wedge)


41

Total material budget: 0.6% X0

(cf. 0.48% for conventional readout)

APV25(thinned to 100µm)

zylon ribcooling pipe

DSSDRohacellKapton

side view

• Thinned readout chips (APV25) on sensor

• Strips of bottom side are connected by flex fanouts wrapped around the edge

• All readout chips are aligned single cooling pipe

• Shortest possible connections high signal-to-noise ratio

zylon rib

APV25 cooling pipe

3-layer kapton hybrid

integrated fanout(or: second metal)

DSSD

single-layer flex wrapped to p-side

Chip on Sensor: The Origami Concept (SVD)

only layers 4-6 (rect. sensors)


42

SVD Mechanics and Material Budget

0 10 20 30 40 50 600

0.5

1

1.5

2

2.5

3

3.5

Profile [mm]

Radi

atio

nLe

ngth

[%]

Sandwich Design

“Batman” distribution of pipe and coolant

CFRP

Pipe APV Kapton

RohacellSensor

Coolant


43

Belle Belle-IIRadius of inner boundary (mm) 77 160Radius of outer boundary (mm) 880 1096Radius of inner most sense wire (mm) 88 168Radius of outer most sense wire (mm) 863 1082Number of layers 50 58Number of total sense wires 8400 15104Effective radius of dE/dx measurement (mm) 752 928Gas He-C2H6 He-C2H6

Diameter of sense wire (m) 30 30

New Central Drift Chamber (CDC)


44

New Central Drift Chamber (CDC)

Belle

Belle-II small cells, longer lever arm

normal cell: 13.3 x 16 mm2

small cell: 5.4 x 5.0 mm2

z-coordinate via standard stereo wire arrangement, charge division planned

dE/dx: 4.8%for 56 layers


45

~400mm

Linear-array type photon detector

LX

20mm

Quartz radiatorx

y

z

2.6m

1.2m

e- : 7 GeV e+ : 4 GeV

forwardbackward

TOP A-RICH

Upgrade: Particle Identification

3σ K/pi separation (barrel)4σ K/pi separation up to 4 GeV

(end caps)

Goal:

TOP: time of propagation



Ring imaging with : – One coordinate with a few mm precision– Time-of-arrival

Excellent time resolution < ~40psrequired for single photon in 1.5T B field

5mm

40cm

2cm

MCP-PMT

Baseline Design for Barrel PID (TOP)

TOP =Time of Propagation


420mm

1145mm

Proximity focusing RICH with silica aerogel asCherenkov radiator for new Belle forward PID

200mm

x-y view of forward end-cap

Baseline Design for Endcap PID (A-RICH)

Aerogel radiator Photodetector

high indexlow indexReadout electronics

Position sensitive PDIn the B field of 1.5Tesla


PID Improvement in Belle-II

2

*

( )~

( )td

ts

Br B V

VBr B K

r g

g

Present Belle PID Belle II PID

difficult becauseof dominating

(Backgroundfrom K‘s misident. as π‘s)

0 0B r g

B r g+ +

B rg

(~ 1/40)

*K g

49

• Increase of dark current due to neutron flux• Fake clusters & pile-up noise

Barrel: 500 ns shaping + 2MHz w.f. sampling.

Endcap: rad. hard crystals with short decay time (e.g. pure CsI) + photopentodes30ns shaping + 43MHz w.f. sampling

Barrel

BW endcap

x1/1.5

x1/5

Calorimeter Upgrade (ECL)

Pileup Reduction:

FADC: 16 samplesC. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010

50

SiPM, e.g.Hamamatsu1.3x1.3 mm2

Iron plate

Aluminum frame

x-strip plane

y-strip plane

• Two independent (x and y) layers in one superlayer made of orthogonal scintillator strips with WLS read out

• Photo-detector: avalanche photodiode in Geiger mode (SiPM) • ~120 strips in one 90º sector

(max L=280cm, w=25mm)• ~30000 read out channels• Geometrical acceptance > 99%

Upgrade of KLM (Endcaps)

676 pixels (20x20µm2)


SuperB Project (INFN)

Proto-Collaboration:Italy, USA, France, Russia, UK, CanadaC. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010 51

Damping ring

Collider hall

SuperB @ LNF

LER: polaized e-

X-angle 60 mrad

HER: 7 GeVLER: 4 GeV

ship LER from PEP,+ parts ofBaBar

ILC-like FF („nano beam“)

L > 1036 / cm sC. Kiesling, KET-Strategie-Workshop 2010, Dortmund, 25.-26. Oktober 2010 52


SuperB Detector

40 cm30 cm

20 cm

Layer0

New SVT:5 + 1 layersL0 under discussion

Some maincomponents fromBaBar (magnet, yoke ..)

New:Drift Chamber,PID (RICH),EM calorimeter(Lyso or CsI ?)


SuperB Project Status

Foil fromrecentpresentationby M. Giorgi

Perspektiven der b-Physik file3 Why is CP Violation Interesting ? The Standard Model SU 3 x SU 2 x U...

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Transcript of Perspektiven der b-Physik file3 Why is CP Violation Interesting ? The Standard Model SU 3 x SU 2 x U...