HVCOM Model for Graphics IP IR Drop Analysis · 2020-06-22 · Nitin Jain ([email protected]),...

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Anand Ananthanarayanan ([email protected]); +91 80 2507 5774; Basavaraj J Kanthi ([email protected]); +91 80 2507 5395; Nitin Jain ([email protected]), +1 916 356 3452; Srikrishnan Venkataraman ([email protected]),+91 80 2507 5956; Intel Corporation Page 84 - ITRS 2011 Edition Executive Summary http://www.itrs.net/Links/2011ITRS/2011Chapters/2011ExecSum.pdf Power Delivery Verification Becoming a Significant Issue!! Impact on Power Grid verification Current Density Wire Resistivity Database Size IR Drop Analysis Time Complexity of Analysis and Debug Operating Voltages Multi voltage Domains Moore’s Law Full-chip Sections Partitions Stdcells Memories Full Chip Layout hierarchy Flat-IR Method of Power Grid verification Limitations Large runtime Huge memory consumption Difficult to Debug Need Overnight runtime Lesser Compute need Same accuracy as Flat-IR Methodology Summary Partitions IR analysis done separately Obtain via currents for partition Select via layer (HVCOM via) to be modeled Create Current sources at HVCOM via Create DEF only for layers above HVCOM via FC IR done with the partition HVCOM DEF files HVCOM Methodology Hierarchical Via Current Override Model Features, Assumptions Upper and lower layers converge separately Uniform grid resistance profile assumed Random current density assumed Not applicable for custom power grids HVCOM Model for Graphics IP IR Drop Analysis Fullchip has abutting sections Sections have abutting partitions Partitions contain stdcells and memories Hierarchical Method From Vendor Partition Abstract Model (PAM) Library & technology Full-chip IR drop analysis IR simulation Data Library & technology Partition IR drop analysis IR simulation Data Partition-1 Abstract View Library & technology Full chip IR drop analysis IR simulation Data Partition-1 Abstract View Partition-N Abstract View Accuracy, Compute Via Current Computation Partition-1 HVCOM View Partition-1 HVCOM View Partition-2 HVCOM View Partition-N HVCOM View Full Chip IR simulation Data Data Prep Analysis - Power Calc - PG Extract - Static IR Run - Power Calc - PG Extract - Full Chip Static IR Run Library & technology ~3x faster 61% less memory 99.9% accurate HVCOM

Transcript of HVCOM Model for Graphics IP IR Drop Analysis · 2020-06-22 · Nitin Jain ([email protected]),...

Page 1: HVCOM Model for Graphics IP IR Drop Analysis · 2020-06-22 · Nitin Jain (nitin.jain@intel.com), +1 916 356 3452; Srikrishnan Venkataraman (srikrishnan.venkataraman@intel.com),+91

Anand Ananthanarayanan ([email protected]); +91 80 2507 5774; Basavaraj J Kanthi ([email protected]); +91 80 2507 5395;

Nitin Jain ([email protected]), +1 916 356 3452; Srikrishnan Venkataraman ([email protected]),+91 80 2507 5956;

Intel Corporation

Page 84 - ITRS 2011 Edition Executive Summary

http://www.itrs.net/Links/2011ITRS/2011Chapters/2011ExecSum.pdf

Power

Delivery

Verification

Becoming a

Significant

Issue!!

Impact on Power Grid verification

Current Density

Wire Resistivity

Database Size

IR Drop Analysis Time

Complexity of Analysis and

Debug

Operating Voltages

Multi voltage Domains

Moore’s Law

Full-chip

Sections

Partitions

Stdcells Memories

Full Chip Layout hierarchy

Flat-IR Method of

Power Grid verif ication Limitations

Large runtime

Huge memory consumption

Difficult to Debug

Need

Overnight runtime

Lesser Compute need

Same accuracy as Flat-IR

Methodology Summary

Partitions IR analysis done separately

Obtain via currents for partition

Select via layer (HVCOM via) to be modeled

Create Current sources at HVCOM via

Create DEF only for layers above HVCOM via

FC IR done with the partition HVCOM DEF files

H VCO M M et h o do l o gy H i e r a r c h i c a l V i a C u r r e n t O v e r r i d e M o d e l

Features, Assumptions

Upper and lower layers converge separately

Uniform grid resistance profile assumed

Random current density assumed

Not applicable for custom power grids

HVCOM Model for Graphics IP IR Drop Analysis

Fullchip has abutting sections

Sections have abutting partitions

Partitions contain stdcells and memories

Hierarchical Method From Vendor

Partit ion Abstract Model (PAM)

Library &

technology Full-chip IR drop analysis

IR s imulat ion Data

Library &

technology Partition IR drop analysis

IR s imulat ion

Data

Partition-1

Abstract View

Library &

technology

Full chip IR drop

analysis

IR s imulat ion Data

Partition-1

Abstract View Partition-N

Abstract View

Accuracy, Compute

Via Current

Computation

Partition-1 HVCOM

View

Partition-1

HVCOM

View

Partition-2

HVCOM

View

Partition-N

HVCOM

View

Fu l l Ch ip IR

s imulat ion

Data

Data Prep Analysis

- Power Calc

- PG Extract

- Static IR Run

- Power Calc

- PG Extract

- Full Chip Static IR Run

Library &

technology

~3x faster 61% less memory 99.9% accurate HVCOM